? 1/7 main product characteristics: where emi filtering in esd sensitive equipment is required : mobile phones and communication systems computers, printers and mcu boards description the emif02-spk01 is a highly integrated device designed to suppress emi/rfi noise in all systems subjected to electromagnetic interferences. the emif02 flip chip packaging means the package size is equal to the die size. this filter includes an esd protection circuitry which prevents the device from destruction when subjected to esd surges up 15kv. benefits emi symmetrical (i/o) low-pass filter high efficiency in emi filtering very low pcb space consuming: 1.07mm x 1.47mm very thin package: 0.65 mm high efficiency in esd suppression high reliability offered by monolithic integration high reducing of parasitic elements through inte- gration & wafer level packaging complies with the following standards: iec 61000-4-2 level 4 on input pins 15kv (air discharge) 8kv (contact discharge) level 1 on output pins 2kv (air discharge) 2kv (contact discharge) mil std 883e -method 3015-6 class 3 EMIF02-SPK01F1 rev. 3 flip-chip (5 bumps) october 2004 figure 1: pin configuration (ball side) b 1 32 c a i1 gnd i2 o2 o1 figure 2: basic cell configuration input output gnd gnd gnd low-pass filter ri/o = 10 cline = 200pf ? 2 lines emi filter and esd protection ipad? tm: ipad is a trademark of stmicroelectronics. table 1: order code part number marking EMIF02-SPK01F1 fx
EMIF02-SPK01F1 2/7 table 2: absolute ratings (limiting values) table 3: electrical characteristics (t amb = 25 c) symbol parameter and test conditions value unit t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to 50 c symbol parameter v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current r i/o series resistance between input & output c line input capacitance per line symbol test conditions min. typ. max. unit v br i r = 1 ma 6 8 v i rm v rm = 3v per line 500 na r i/o tolerance 20% 10 ? c line v r = 0v 200 pf figure 3: s21 (db) attenuation measurements and aplac simulation figure 4: analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -35.00 -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 db f/hz 1.0m - - - - - - 100.0k 1.0m 10.0m 100.0m 1.0g -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 db f/hz - - - - - - i v i pp v cl v br v rm i r i rm i rm i r i pp v rm v br v cl
EMIF02-SPK01F1 3/7 figure 5: esd response to iec61000-4-2 (+ 15kv air discharge) on one input v(in) and one output v(out) figure 6: esd response to iec61000-4-2 (15kv air discharge) on one input v(in) and one output v(out) figure 7: line capacitance versus applied voltage c(pf) 0 50 100 150 200 250 012345 v(v) r f=1mhz v osc =30mv rms t j =25c
EMIF02-SPK01F1 4/7 figure 8: aplac model figure 9: aplac parameters model = d1 model = d2 model = d2 in1 model = d1 out1 rbump lbump lbump rbump rspk lspk rbump lbump lbump rbump rspk lspk model = d3 in2 out2 gnd lsub rsub rbump lbump lgnd rgnd cgnd gnd EMIF02-SPK01F1 model ground return aplacvar ls 1nh aplacvar rs 150m aplacvar rspk 10 aplacvar lspk 10p aplacvar cdiode1 234pf aplacvar cdiode2 3.5ppf aplacvar cdiode3 1nf aplacvar lbump 50ph aplacvar rbump 10m aplacvar rsub 0.5m aplacvar lsub 10ph aplacvar rgnd 1m aplacvar lgnd 50ph aplacvar cgnd 0.15pf model d1 cjo=cdiode1 bv=7 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.7 vj=0.6 tt=50n model d2 cjo=cdiode2 bv=7 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.3 vj=0.6 tt=50n model d3 cjo=cdiode3 bv=7 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.12 vj=0.6 tt=50n
EMIF02-SPK01F1 5/7 figure 10: order code figure 11: flip-chip package mechanical data figure 12: foot print recommendations figure 13: marking emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip-chip x = 1: 500m, bump = 315m = 2: leadfree pitch = 500m, bump = 315m 1.07mm 50m 1.47mm 50m 5 00m 15 315m 50 500m 10 250m 10 650m 50 copper pad diameter : 250m recommended , 300m max solder stencil opening : 330m solder mask opening recommendation : 340m min for 315m copper pad diameter dot, st logo xx = marking yww = datecode (y = year ww = week) z = packaging location 365 365 240 40 220 x y x w z w all dimensions in m
EMIF02-SPK01F1 6/7 figure 14: flip-chip tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 +/- 0.1 8 +/- 0.3 4 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 ? 1.5 +/- 0.1 0.73 +/- 0.05 xxx yww st xxx yww st xxx yww st table 4: ordering information note: more packing informations are available in the application notes an1235: ''flip-chip: package description and recommandations for use'' an1751: "emi filters: recommendations and measurements" ordering code marking package weight base qty delivery mode EMIF02-SPK01F1 fxt flip chip 2.1 mg 5000 tape & reel (7?) table 5: revision history date revision description of changes jan-2004 2a last update. 07-oct-2004 3 pin configuration figure one page one: ?c? bumps range re-allocated
EMIF02-SPK01F1 7/7 information furnished is believed to be accurate and reliable. however, stmicroelectronics assu mes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replac es all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered tr ademark of stmicroelectronics. all other names are the property of their respective owners ? 2004 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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